Such as number of packages or wafers cut, linear feet or meters cut. For example, if a particular vendors dicing blade can cut up to twenty five thousand cuts, however at eighteen thousand cuts inconsistency surfaces, the yields deviate. Yield deviation negatively affects production and quality control. At the same time as dicing blades become more inconsistent, dicing saw operators must monitor the process more closely and make necessary parameter changes. These parameter changes may extend dicing blade life back to twenty five thousand cuts. Unit cost should be directly correlated to dicing blade life in linear millimeters.
For example if blade X cost eighteen thousand dollars as an example. On the other hand if dicing blade Y costs twenty two thousand dollars, however cuts one hundred fifty thousand linear millimeters. As you can see the higher cost blade is more economical to use. At first glance the Y dicing blade appears to cost four dollars more than blade X.
When dicing blade yield has be evaluated, dicing blade Y saves you more money, as well as reduces operator involvement in blade change and set up time. Materials you are planning to cut will have a large impact in the types of diamond dicing blade you can use. If you are dicing ultra hard and brittle materials such as alumina or sapphire, it is generally recommended that you use a soft bond, thin kerf dicing blades such as Resin Bond. However, if you are cutting softer materials, material minimum thickness such as substrates and wafers.
While softer and abrasive materials require a harder bond blade bond matrix, to last longer. Harder bond matrixes hold diamond in place for very long time, providing longer blade life. This requires use of very hard diamond particles in order for the dicing blade to maintain its sharp edges for long periods of time.
Material Hardness is defined as the materials capability to resist deformation. All materials are classified by their scale of hardness.
Material hardness is measured by many different hardness scales such as Mohs, Vickers, Knoop and other scales of hardness. Material Thickness — will determine blade diameter, thickness, blade exposure ratio, dicing blade bond type, diamond size and concentration to use. Depth of Cut - To optimize a blade's capability in cutting, always take into account the thickness of the blade, and the exposure needed to reach the required depth. Dicing process is used in a large variety of industries and applications.
Singulation - dicing process used in semiconductor industry. Where diamond dicing blade is used for die and package separation. Scribing — process when cutting is not completely through the material. Final separation is done by breaking. Dicing process is also used for cutting very hard and brittle materials partially or completely through wide range of materials such as ceramics, optical glass, composites and many other materials.
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Dicing creates almost perfect edges, scribing allows much higher cutting speeds. Blade life is typically 2 to 4 times higher in scribing operation. Diamond particles are hold together with a binder such as resin bond, sintered metal bond or nickel bond electroplated. Each diamond particles grinds away material on micro level. Why use Diamond or CBN? Diamond is the hardest material known to man kind.
Things about Diamond Dicing Tools
When used in dicing blades, diamond grinds away material on micro nano level. Due to its hardness Diamond will work all types of materials from hardness of 40 on Rockwell scale and up.
Diamond Blades will machine hardest material, including those materials that other conventional types of abrasives, carbide and high speed steel will not. Diamond hardness, wear resistance and high natural strength are unchallenged among conventional abrasives. Hubbed Diamond Dicing blades — dicing blade is already mounted on hub, comes ready to use.
Once the blade is used, it is disposed. The flange assembly.
The same assembly is used all the time. Typically applications that use hubless type of diamond dicing blades where effecting cooling of blade during cutting process is very important to obtain maximum results. For some applications such as cutting silicon wafers, hubbed dicing blades offer the greatest blade life, require minimum set up time, and provide better consistency. Hubless dicing blades are more sensitive to foreign particles such a s slurry accrued from cutting wafers.
Careful attention to detail should be taken in order to clean the inner and outer flanges when mounting these blades. Hubbed diamond dicing blades have the following Advantages:. Easier blade handling for the operator Blade is plated on very accurate aluminum hub, it is stiffer. Hence producing better cut quality. This can bee seen in the kerf having straight cross section and longitudinal cut through the street being straight and parallel to the street.
Fewer vibration on the blade during cutting, due to increase blade stiffness. Hubless dicing blades advantages. Can be re used with smaller flanges All the operator to utilize and experiment with different flange types best suited for their application High cooling flange are available, allowing water directly onto the blade.
This provides better blade and substrate cooling, resulting in better cut quality and longer blade life. Recommended for applications where cut quality and surface finish is very important.
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Recommended for users requiring very straight cuts and larger blade exposures. Nickel Bond dicing blades are available with and without hubs. Widely used for cutting wafers and thin substrates. Nickel Bond dicing blades provide minimum level of chipping on wide variety materials. Sintered Metal bonded diamond blades diamonds sintered and multiple layers of diamonds impregnated inside the metal matrix. The compacted materials are then hot pressed or sintered to full density.
Heating rate, applied pressure, sintering temperature and holding time, are all controlled according to the matrix composition.
This means that selected diamonds are mixed and sintered with specific metal alloys to achieve the best cutting performance possible on any large variety of material. The metal bond surrounding the diamonds must wear away to continuously keep re-exposing the diamonds for the diamond tool to continue cutting. Sintered metal bonded dicing blades are recommended for cutting wide variety of materials from 45 to 75 on Rockwell Scale 5 to 9.
As a general rule of thumb, Metal Bond sintered diamond dicing blades longer than other diamond bond blades such as resin bond and electroplated nickel bond blades. Metal bond matrix does not protrude diamonds very high and hence usually requires lower cutting speeds than electroplated nickel bond and resin bond blades.
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In many dicing applications sintered metal bond dicing blades are used in applications which are not super hard or super brittle and with minimum tendency to produce chips or cracks. Cuts almost any material Clan cuts on hard and brittle material Any blade thickness is available. Resin Bond is the softest of all the bonds, frequently used in applications that require a smooth surface. This self sharpening characteristic of resin bond dicing blades, based on faster bond wear out is what make this blade choice in almost half of all dicing application.
Typical Resin Bond Diamond Blades last less than Sintered Metal Bond diamond blades, but more than electroplated nickel bond diamond blades. Some disadvantages of resin bond dicing blades is resin bond must remain very fragile in order to expose new diamonds. Resin bond is the softest of the all the dicing bond matrixes. For this reason, strong and high quality diamonds cannot be used in a resin bond. High quality diamonds are harder than a resin bond matrix, and would soon disintegrate the bond that keeps them in place.
USA1 - Dicing blade - Google Patents
This brings about the need for frequent blade dressing, causing the cut to loose its roundness or form. Another disadvantage of Resin bond is its high wear rate, lack of stiffness, and thickness limitation. Thinnest blades that can be produced in resin bond is. Many of the resin bond dicing blade weaknesses and limitation have been resolved by utilizing different phenolic resin types, mixtures, fillers, and molding techniques in our New Generation Extended wear resin bond and Hybrid bond dicing blades.
Hence increasing their field or use in greater amount of applications. Very low blade wear Maintains good edge geometry Excellent on applications requiring high accuracy Ultra thin blade thickness are available such. Blade thickness is limited to. Diamonds have higher protrusion ratio, staying on the surface of the cut allowing for fast material removal. Electroplated Diamond Blades last less than metal bond, resin bond, hybrid bond blades and are the least expensive diamond blades available.